Equivalent circuit model of the IC-Stripline coupling to IC package

As the operating frequency of integrated circuit (IC) is rapidly increased, the importance of electromagnetic compatibility (EMC) performance test in the design stage of IC development process is becoming more significant. The new EMC test method, IC-Stripline enables fast and accurate EMC test with smaller form factor and lower cost compared with transverse electromagnetic (TEM) cell which is the most widely used for radiated electromagnetic interference test at the moment. This paper presents the equivalent lumped-element circuit model to capture capacitive and inductive coupling between open version of IC-Stripline and an IC package. Also, the equations to calculate the circuit components with geometrical structure of IC-Stripline are proposed. The S-parameter results from presented circuit models are compared against those obtained by 3D EM solver. The presented models are very accurate up to 3 GHz which is the upper limit of effective frequency range of IC-Stripline described in IEC standards [1], [2]. Therefore, the proposed IC-Stripline models can be effectively used to predict radiated emission and immunity of ICs using circuit level simulation tools.