• DocumentCode
    1663707
  • Title

    A 0.4mW/Gb/s 16Gb/s near-ground receiver front-end with replica transconductance termination calibration

  • Author

    Kaviani, Kambiz ; Amirkhany, Amir ; Huang, Charlie ; Le, Phuong ; Madden, Chris ; Saito, Keisuke ; Sano, Koji ; Murugan, Vinod ; Beyene, Wendem ; Chang, Ken ; Yuan, Chuck

  • Author_Institution
    Rambus, Sunnyvale, CA, USA
  • fYear
    2012
  • Firstpage
    132
  • Lastpage
    134
  • Abstract
    The growing demand for low-power and high-fidelity chip-to-chip data communication has motivated the use of near-ground or low-common-mode voltage (LCM) signaling [1-2]. However, deployment of such signaling for high-speed applications such as graphics memory interfaces has been hampered by complications of the transmitter and receiver designs. Recent techniques have enhanced the performance of source-series terminated transmitters by accommodating impedance and equalization calibration at a low power cost [3]. This work advances LCM receiver high-frequency operation by introducing an accurate termination calibration, taking into account the receiver loading on the data link channel. Our receiver also incorporates common-mode-to-differential-gain cancellation and in-situ equalization calibration for reliable data reception at 16Gb/s over a 3” FR4 PCB memory link with 15dB loss at Nyquist frequency.
  • Keywords
    data communication; radio receivers; Nyquist frequency; PCB memory link; bit rate 16 Gbit/s; chip-to-chip data communication; common-mode-to-differential-gain cancellation; data link channel; graphics memory interfaces; high-speed applications; impedance calibration; in-situ equalization calibration; low-common-mode voltage signaling; near-ground receiver front-end; reliable data reception; replica transconductance termination calibration; Calibration; Loading; Receivers; Resistors; Temperature measurement; Transceivers; Transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-0376-7
  • Type

    conf

  • DOI
    10.1109/ISSCC.2012.6176950
  • Filename
    6176950