DocumentCode
1664347
Title
A ΔΣ interface for MEMS accelerometers using electrostatic spring-constant modulation for cancellation of bondwire capacitance drift
Author
Lajevardi, Pedram ; Petkov, Vladimir ; Murmann, Boris
Author_Institution
Stanford Univ., Stanford, CA, USA
fYear
2012
Firstpage
196
Lastpage
198
Abstract
Precision accelerometers are used in a variety of automotive applications, navigation systems, and low-level vibration-monitoring systems. Currently, these sensors are factory-calibrated to null their input offset. However, the residual offset drifts mainly due to thermal and mechanical stress and humidity. As a result, the offset accuracy of high-end MEMS accelerometers is specified on the order of ±100mg. With continuously increasing precision requirements, it is desirable to develop new techniques that address post-calibration drift. In this paper, we describe an accelerometer interface that continuously measures and cancels offset drift due to change in parasitic capacitance of the bondwires in a system-in-package-type MEMS accelerometer. The proposed technique reduces the bondwire offset of the measured prototypes by 41dB down to 6.24mg.
Keywords
accelerometers; electrostatic devices; micromechanical devices; system-in-package; ΔΣ interface; MEMS accelerometer; accelerometer interface; bondwire capacitance drift; bondwire offset; electrostatic spring-constant modulation; humidity; mechanical stress; parasitic capacitance; precision accelerometer; system-in-package; thermal stress; Accelerometers; Bandwidth; CMOS integrated circuits; Micromechanical devices; Modulation; Noise; Sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4673-0376-7
Type
conf
DOI
10.1109/ISSCC.2012.6176972
Filename
6176972
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