A measurement system for the acquisition of degradation data in AlCu metallizations

Author

Catelani, M. ; Nicoletti, R. ; Baggiani, M. ; Singuaroli, R.

Author_Institution

Dept. of Electron. & Telecommun., Florence Univ., Italy

Volume

1

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

511

Abstract

A fully custom designed automatic measurement system has been realized in order to acquire degradation data on thin-film AlCu metal test patterns, performing 4-wire resistive measures. A thermal reliability test is performed and degradation data are presented.

Keywords

aluminium alloys; automatic test equipment; copper alloys; data acquisition; electromigration; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; thermal stresses; voids (solid); ASDA board; AlCu; LabView software; PC serial port; RS-232 protocol; ULSI; VLSI; automatic measurement system; degradation data acquisition; digital multimeter; electromigration; four-wire resistive measures; fully custom designed system; stress voiding; thermal reliability test; thermal stress; thin-film metal test patterns; Automatic testing; Circuit testing; Decoding; Metallization; Performance evaluation; System testing; Thermal degradation; Thermal stresses; Transistors; Variable speed drives;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 2002. IMTC/2002. Proceedings of the 19th IEEE

ISSN

1091-5281

Print_ISBN

0-7803-7218-2

Type

conf

DOI

10.1109/IMTC.2002.1006895

Filename

1006895