A Monolithic 500V, 1A Three Phase Motor Driver with Small Line Surface Mount Package

This paper presents a complete monolithic 500V, 1A three phase motor driver. The single chip is composed of n-ch. lateral IGBTs, HV-diodes, 24V CMOS and HV-NMOS structures fabricated on an SOI (Silicon On Insulator) substrate using trench isolation techniques. The chip is assembled into a newly designed surface mount SOP (small outline package) with a body size of only 17.5 mm times 8.4 mm. This package is very attractive for reduction of circuit footprint and simplified manufacturing. The package utilizes bundled groups of pins to provide efficient heat transfer to printed circuit board. In addition, the lead frame utilizes a reverse bend so that heat can efficiently radiate from the top surface of the package.