• DocumentCode
    1665160
  • Title

    Copper Toxicity on the Development and Architecture of Rice Root

  • Author

    Xu, Jiakuan ; Wang, Yulong ; Liu, Jianguo

  • Author_Institution
    Agric. & Forestry Bur. of Changzhou, Changzhou
  • fYear
    2008
  • Firstpage
    4470
  • Lastpage
    4474
  • Abstract
    Three years of pot soil experiments showed that copper (Cu) could be toxic to rice root depending on its concentrations. Root development began to be inhibited at the soil Cu concentration of 100 mg kg-1. About half of root dry weights lost at the soil Cu concentration of 300 - 500 mg kg-1. Root growth nearly stopped at the soil Cu concentration of 800 - 1000 mg kg-1. There were interactions between rice growth stages and soil Cu concentrations on Cu toxicity to rice root. The soil Cu level of 400 mg kg-1 inhibited total root length per plant and average length of root system significantly (P<0.05), and the inhibiting effects increased with the time of soil Cu stress. However the differences between two rice cultivars (Shanyou 63 and Wuxiangjing 14) were small respecting reducing rates of root length under soil Cu stress. Soil Cu treatment increased cell layers and the thickness of cell wall in epidermis at root bases and root tips. The thickness of epidermis was 75% more at root base, and 27% more at root tip, for soil Cu treatment than for the control Under soil Cu treatment, the cells of cortex were larger and distorted, and the vessels were distorted and lessened, compared to the control.
  • Keywords
    biochemistry; botany; cellular biophysics; copper; crops; soil; toxicology; Cu; Shanyou 63 rice; Wuxiangjing 14 rice; cell wall thickness; copper toxicity; epidermis thickness; rice growth stage; rice root; root base; root tips; soil copper concentration; Agricultural engineering; Copper; Crops; Epidermis; Forestry; Genetics; Physiology; Safety; Soil; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Biomedical Engineering, 2008. ICBBE 2008. The 2nd International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1747-6
  • Electronic_ISBN
    978-1-4244-1748-3
  • Type

    conf

  • DOI
    10.1109/ICBBE.2008.611
  • Filename
    4535491