DocumentCode
1665250
Title
The Effect of Cu on Ultrastructure of Wheat
Author
Xiao, Xin ; Feng, Qiyan ; Ding, Yi ; Meng, Qing Jun ; Zhang, Shuang
Author_Institution
Sch. of Environ. & Spatial Inf., China Univ. of Min. & Technol., Xuzhou
fYear
2008
Firstpage
4484
Lastpage
4487
Abstract
Transmission electron microscope (TEM) was used to investigate the damage of wheat seedlings by copper and the distribution of Cu2+ in different parts of wheat seedlings was discussed. Experiment showed that Cu is more susceptible to migration than other metals in wheat cells. Needle dark electron dense particles were existed in leaves cells with 5 mg/L Cu stressed. Swollen cristae in mitochondria were existed in cells with 50 mg/L stressed, while mitochondria were almost disappear with 100 mg/L stressed. Chloroplast increased in wheat leaves under low concentration Cu2+ stressed while swollen chloroplast and disrupted chloroplast membrane and cascade structure damaged of chloroplast stroma were existed under high concentration. The inference of Cu2+ on wheat root nucleolus was serious. Disruption of nuclear membrane, multi-vesicle nucleoplasm and agglutination of nucleus chromatin were appeared at root cells under 50 mg/L Cu2+ and more serious damage were appeared under 100 mg/L Cu2+.
Keywords
agriculture; soil pollution; transmission electron microscopy; TEM; agglutination; chloroplast stroma; copper; cristae; heavy metal pollution; leaves cells; mitochondria; multivesicle nucleoplasm; needle dark electron dense particles; nuclear membrane; nucleus chromatin; root cells; transmission electron microscopy; ultrastructure; wheat cells; wheat root nucleolus; wheat seedlings; Biomembranes; Cells (biology); Copper; Electron microscopy; Filters; Lighting; Lipidomics; Physiology; Pollution; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomedical Engineering, 2008. ICBBE 2008. The 2nd International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1747-6
Electronic_ISBN
978-1-4244-1748-3
Type
conf
DOI
10.1109/ICBBE.2008.614
Filename
4535494
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