• DocumentCode
    1665250
  • Title

    The Effect of Cu on Ultrastructure of Wheat

  • Author

    Xiao, Xin ; Feng, Qiyan ; Ding, Yi ; Meng, Qing Jun ; Zhang, Shuang

  • Author_Institution
    Sch. of Environ. & Spatial Inf., China Univ. of Min. & Technol., Xuzhou
  • fYear
    2008
  • Firstpage
    4484
  • Lastpage
    4487
  • Abstract
    Transmission electron microscope (TEM) was used to investigate the damage of wheat seedlings by copper and the distribution of Cu2+ in different parts of wheat seedlings was discussed. Experiment showed that Cu is more susceptible to migration than other metals in wheat cells. Needle dark electron dense particles were existed in leaves cells with 5 mg/L Cu stressed. Swollen cristae in mitochondria were existed in cells with 50 mg/L stressed, while mitochondria were almost disappear with 100 mg/L stressed. Chloroplast increased in wheat leaves under low concentration Cu2+ stressed while swollen chloroplast and disrupted chloroplast membrane and cascade structure damaged of chloroplast stroma were existed under high concentration. The inference of Cu2+ on wheat root nucleolus was serious. Disruption of nuclear membrane, multi-vesicle nucleoplasm and agglutination of nucleus chromatin were appeared at root cells under 50 mg/L Cu2+ and more serious damage were appeared under 100 mg/L Cu2+.
  • Keywords
    agriculture; soil pollution; transmission electron microscopy; TEM; agglutination; chloroplast stroma; copper; cristae; heavy metal pollution; leaves cells; mitochondria; multivesicle nucleoplasm; needle dark electron dense particles; nuclear membrane; nucleus chromatin; root cells; transmission electron microscopy; ultrastructure; wheat cells; wheat root nucleolus; wheat seedlings; Biomembranes; Cells (biology); Copper; Electron microscopy; Filters; Lighting; Lipidomics; Physiology; Pollution; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Biomedical Engineering, 2008. ICBBE 2008. The 2nd International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1747-6
  • Electronic_ISBN
    978-1-4244-1748-3
  • Type

    conf

  • DOI
    10.1109/ICBBE.2008.614
  • Filename
    4535494