Title :
A 2Gb/s-throughput CMOS transceiver chipset with in-package antenna for 60GHz short-range wireless communication
Author :
Mitomo, Toshiya ; Tsutsumi, Yukako ; Hoshino, Hiroaki ; Hosoya, Masahiro ; Wang, Tong ; Tsubouchi, Yuta ; Tachibana, Ryoichi ; Sai, Akihide ; Kobayashi, Yuka ; Kurose, Daisuke ; Ito, Tomohiko ; Ban, Koichiro ; Tandai, Tomoya ; Tomizawa, Takeshi
Author_Institution :
Toshiba, Kawasaki, Japan
Abstract :
High-speed and energy-efficient wireless communication using the 60GHz band is attracting attention, and recent works have realized a highly integrated CMOS transceiver (TRX) [1-2]. This paper presents a fully integrated chipset for short-range/one-to-one wireless communication. The chipset is composed of 2 chips, an RF chip with in-package antenna and a BB chip including PHY/MAC layer. The chipset achieves 2.62Gb/s PHY data rate and 2.07Gb/s MAC throughput. The MAC is designed to have a high efficiency feature due to short interval DATA/Acknowledgement (ACK) frame exchange. It is realized by fast transmitter (TX)/receiver (RX) switching. Achieved energy consumption of 651pJ/bit is the lowest value in the compared TRXs that include a MAC layer.
Keywords :
CMOS integrated circuits; access protocols; antennas; energy conservation; radio links; radio receivers; radio transceivers; radio transmitters; radiofrequency integrated circuits; telecommunication switching; ACK frame exchange; BB chip; MAC throughput; PHY data rate; PHY-MAC layer; RF chip; acknowledgement frame exchange; bit rate 2 Gbit/s; energy consumption; frequency 60 GHz; high-speed energy-efficient wireless communication; in-package antenna; integrated CMOS transceiver chipset; one-to-one wireless communication; short interval DATA exchange; short-range wireless communication; transmitter-receiver switching; Antenna measurements; Antennas; Integrated circuits; Radio frequency; Semiconductor device measurement; Switches; Wireless communication;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-0376-7
DOI :
10.1109/ISSCC.2012.6177010
