Title :
DBC Technology for Extremely Thin Flat Heat Pipes
Author :
Kamenova, L. ; Avenas, Y. ; Schaeffer, C. ; Kapelski, G. ; Tzanova, S. ; Schulz-Harder, J.
Author_Institution :
INPG St.-Martin-d´Heres, Paris
Abstract :
This paper presents the conception and the experimental procedures of flat copper heat pipe embedded in extremely thin 3D packaging substrates. Since conventional machining for this application is very complicated and expensive, the DBC (Directed Bonded Copper) technology proved to be more interesting for mass production. The experimental results demonstrated that the DBC heat pipe is an excellent solution to enhance the heat transfer within the 3D packaging.
Keywords :
heat pipes; heat transfer; integrated circuit bonding; integrated circuit packaging; machining; 3D packaging substrates; conventional machining; directed bonded copper technology; heat pipes; heat transfer; Bonding; Conducting materials; Copper; Electronic packaging thermal management; Heat sinks; Heat transfer; Space technology; Thermal conductivity; Thermal management; Thermal management of electronics;
Conference_Titel :
Industry Applications Conference, 2007. 42nd IAS Annual Meeting. Conference Record of the 2007 IEEE
Conference_Location :
New Orleans, LA
Print_ISBN :
978-1-4244-1259-4
DOI :
10.1109/07IAS.2007.218
