DocumentCode
1666772
Title
Multimode rate-equation-based VCSEL thermal and spatial model of circuit level
Author
Shi, Xinzhi ; Qi, Chan ; Wang, Gaofeng ; Hu, Jicheng ; Liu, Feng
Author_Institution
Inst. of Microelectron. & Inf. Technol., Wuhan Univ., Wuhan, China
fYear
2010
Firstpage
1297
Lastpage
1298
Abstract
In recent years, the characteristics of VCSELs have improved enormously that they have attracted more considerable interest. The corresponding developments of circuit-level VCSEL models are required for use in the design and simulation of optoelectronic applications. Unfortunately, existing models lack either the computational efficiency or the comprehensiveness warranted. In this paper, we present a VCSEL model that addresses the spatial dependent and thermal behavior of VCSELs based on multimode rate equations without sacrificing the numerical efficiency demanded by the circuit-level simulation of optoelectronic systems. Moreover, the thermal behavior is modeled by a laser diode based on Tucker´s model with the parameters extracted directly by method of Gao and temperature dependent parasitic resistor and reverse saturation current are also considered. The equivalent circuit of the model is given and it is implemented into SPICE-like simulators to simulate the dc, ac and transient features of a 863 nm bottom-emitting AlGaAs VCSEL. The simulated results exhibit good agreements with references.
Keywords
III-V semiconductors; aluminium compounds; equivalent circuits; integrated optics; integrated optoelectronics; surface emitting lasers; AlGaAs; Tucker model; bottom emitting VCSEL; circuit level VCSEL; circuit level simulation; multimode rate equation; optoelectronic application; spatial model; thermal model; Circuit simulation; Computational efficiency; Computational modeling; Diode lasers; Equations; Equivalent circuits; Resistors; Temperature dependence; Thermal resistance; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424891
Filename
5424891
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