• DocumentCode
    1666882
  • Title

    Routing in Three Dimensional Wireless Sensor Networks

  • Author

    Salti, Tarek El ; Nasser, Nidal

  • Author_Institution
    Dept. of Comput. & Inf. Sci., Univ. of Guelph, Guelph, ON
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Sensor networks is a promising technology that can be used to avoid disasters such as fire, storm, etc. This technology needs to be improved in terms of several issues. In this paper, we focus on two issues: coverage and routing. For coverage problem, we introduce a new approach for obtaining a static covered network in the 3-D environment. This technique is referred to as the Chipset model. This would be accomplished by using a small number of sensor nodes in order to save up some energy. For routing issue, we propose a new position-based routing protocol referred to as the 3-D Sensing Spheres close to the line routing algorithm (3-D SSL). We show that this protocol achieves 100% delivery rate on top of our 3-D model. We also show that even this protocol has similar performance with the 3-D GF in terms of hop dilation and total running time, the 3-D SSL outperforms the 3-D GF in terms of Euclidean dilation. Thus, this might reduce the energy consumption of the nodes. Therefore, prolonging the lifetime of the network.
  • Keywords
    routing protocols; wireless sensor networks; 3D environment; 3D sensing spheres; Chipset model; Euclidean dilation; energy consumption; hop dilation; line routing algorithm; position-based routing protocol; sensor nodes; static covered network; three dimensional wireless sensor networks; Centralized control; Computer networks; Energy consumption; Fires; Information science; Routing protocols; Sensor systems; Storms; Temperature sensors; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Global Telecommunications Conference, 2008. IEEE GLOBECOM 2008. IEEE
  • Conference_Location
    New Orleans, LO
  • ISSN
    1930-529X
  • Print_ISBN
    978-1-4244-2324-8
  • Type

    conf

  • DOI
    10.1109/GLOCOM.2008.ECP.25
  • Filename
    4697800