A 1V 357Mb/s-throughput transferjet™ SoC with embedded transceiver and digital baseband in 90nm CMOS

Author

Tamura, Masahisa ; Kondo, Fumitaka ; Watanabe, Katsumi ; Aoki, Yasunori ; Shinohe, Yusuke ; Uchino, Koki ; Hashimoto, Yuhei ; Nishiyama, Fumihiro ; Miyachi, Hiroaki ; Nagase, Ikuho ; Uezono, Itaru ; Hisamura, Rie ; Maekawa, Itaru

Author_Institution

Sony, Tokyo, Japan

fYear

2012

Firstpage

440

Lastpage

442

Abstract

TransferJet™, based on DSSS-UWB, is a promising standard protocol which provides users high-speed, short-range, simple-usage, low-power and robust connectivity. Since its communication distance is limited to a few centimeters, the required TX output power is small enough to meet regulatory restrictions in many countries. This paper presents the first SoC that implements PHY and Connection Layer (CNL) functionality from the TransferJet™ and ECMA-398 standards. All the RF building blocks as well as digital baseband are integrated including PHY, CNL and SDIO 3.0 device controller. A coupler and an RF BPF are the only external components required to complete a wireless system.

Keywords

CMOS integrated circuits; protocols; radio transceivers; radiofrequency integrated circuits; spread spectrum communication; system-on-chip; ultra wideband communication; DSSS-UWB; ECMA-398 standards; PHY layer; RF building blocks; SDIO 3.0 device controller; bit rate 357 Mbit/s; communication distance; connection layer; digital baseband; embedded transceiver; size 90 nm; standard protocol; throughput Transferjet SoC; voltage 1 V; wireless system; CMOS integrated circuits; Clocks; Phase locked loops; Phase noise; Radio frequency; System-on-a-chip; Voltage control;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International

Conference_Location

San Francisco, CA

ISSN

0193-6530

Print_ISBN

978-1-4673-0376-7

Type

conf

DOI

10.1109/ISSCC.2012.6177081

Filename

6177081