An effective ESD program management based on S20.20 plus ESD capability/risk analysis

The semiconductor back end manufacturing process starts from the wafer dicing process and finishes with the final tested product with many processes in between where the ESD protection requirement may vary to a great extent. To have an effective ESD control of the different process steps, an ESD protection concept based on S20.20 alone is not sufficient. The control strategy additionally should be based on ESD process capability/risk analysis. The paper provides a macro overview on how an effective ESD program management is established in a semiconductor manufacturing facility.