Defect detection of terminal lead by single stereo vision

Due to the miniaturization and complication of the size of electronic devices, it is recently required to maximize the inspection performance especially in precision. It is especially difficult to detect very small defects of the small electronic devices in size. In addition to these requirements, the performances of the inspection in cost and speed should be realized. For realizing these subjects of the inspection, image processing based on the silhouette and 3D images is promising. Especially, because the defect of terminal lead causes the failure of the solder on the printed circuit board, the defects on the terminal leads become fatal. Then we applied 3D images to the inspection of terminal lead for improving its performance in size. In this case we implemented a single camera 3D image acquisition system small enough for the real application to the production line.