Title :
Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups
Author :
Tazzoli, A. ; Malobabic, S. ; Vashchenko, V.
Author_Institution :
Maxim Integrated Corp., San Jose, CA, USA
Abstract :
Experimental results supported by mixed-mode simulations show how standalone ESD clamps can provide different passing levels from system-level ESD tests due to the variable impedance of the discharge current path with varied test-board size. This can lead to overdesign of the ESD protection clamp if IEC61000-4-2 current amplitudes specifications are considered, or misleading test results.
Keywords :
IEC standards; electrostatic discharge; finite element analysis; semiconductor device testing; thyristors; ESD protection clamp; FEM; IEC61000-4-2 current amplitude specifications; SCR; discharge current path; finite element method; horizontal coupling plane interaction; mixed-mode simulations; silicon controlled rectifier; system-level ESD test setups; test fixture; test-board size; Capacitance; Clamps; Discharges (electric); Electrostatic discharges; Impedance; Integrated circuit modeling; Voltage measurement;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th
Conference_Location :
Tucson, AZ
