• DocumentCode
    1668667
  • Title

    Nonvolatile memory properties in ZnO-based thin-film transistors with polymer ferroelectric and thin buffer layer

  • Author

    Park, C.H. ; Lee, K.H. ; Lee, B.H. ; Sung, Myung M. ; Im, Seongil

  • Author_Institution
    Inst. of Phys. & Appl. Phys., Yonsei Univ., Seoul, South Korea
  • fYear
    2010
  • Firstpage
    1185
  • Lastpage
    1186
  • Abstract
    We report the fabrication of ZnO non-volatile memory thin-film transistors (NVM-TFTs) with thin poly(vinylidene fluoride/trifluoroethylene)[P(VDF-TrFE)] ferroelectric layer and thin Al2O3 buffer layers. When our memory TFT has a thin Al2O3 layer inserted between P(VDF-TrFE) and ZnO channel: 5 nm, 10 nm and 20 nm. Our NVM-TFT operates on glass substrates under low voltage write-erase (WR-ER) pulse of ±20 V with high field effect mobilities of 0.6-1 cm2/Vs. The device with the Al2O3 layer shows much longer retention properties over 104 s than the other without buffer. Depending on the thickness of buffer, our NVMTFT displays maximum memory window of ~20 V and also exhibits WR-ER current ratio of 4×102.
  • Keywords
    II-VI semiconductors; MFIS structures; alumina; buffer layers; carrier mobility; ferroelectric storage; ferroelectric thin films; nanoelectronics; polymer films; random-access storage; semiconductor thin films; thin film transistors; wide band gap semiconductors; zinc compounds; NVM-TFT; WR-ER current ratio; low voltage write-erase pulse; memory TFT; metal-ferroelectric-insulator-semiconductor structures; mobilities; nonvolatile memory thin-film transistors; poly(vinylidene fluoride-trifluoroethylene); polymer ferroelectric layer; retention properties; thin buffer layer; Buffer layers; Fabrication; Ferroelectric materials; Glass; Low voltage; Nonvolatile memory; Polymers; Substrates; Thin film transistors; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424966
  • Filename
    5424966