DocumentCode :
1668988
Title :
Partial trench isolated body-tied (PTIBT) structure for SOI applications
Author :
Min, B.W. ; Dakshina-Murthy, S. ; Mendicino, M.
Author_Institution :
Digital DNA Labs., Motorola, Austin, TX, USA
fYear :
2001
Firstpage :
71
Lastpage :
72
Abstract :
Silicon on insulator (SOI) technology has gained interest to provide improvements in speed and power consumption over bulk technologies. However, floating body effects of SOI devices such as kinks, parasitic bipolar action and hysteretic propagation delay have retarded its application. To eliminate these undesirable effects several body-tied structures have been suggested, but all generally suffer from adverse costs such as performance degradation and/or process complexity. We propose a novel body-tied structure, adding simple partial trench isolation, which effectively suppresses the floating body effects without performance degradation.
Keywords :
MOSFET; scanning electron microscopy; semiconductor device measurement; silicon-on-insulator; PTIBT; SOI applications; floating body effect suppression; floating body effects; hysteretic propagation delay; kinks; parasitic bipolar action; partial trench isolated body-tied structure; silicon on insulator; CMOS process; CMOS technology; Capacitance; DNA; Degradation; Energy consumption; Etching; Isolation technology; Laboratories; Silicon on insulator technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2001 IEEE International
Conference_Location :
Durango, CO, USA
ISSN :
1078-621X
Print_ISBN :
0-7803-6739-1
Type :
conf
DOI :
10.1109/SOIC.2001.957990
Filename :
957990
Link To Document :
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