Title :
Partial trench isolated body-tied (PTIBT) structure for SOI applications
Author :
Min, B.W. ; Dakshina-Murthy, S. ; Mendicino, M.
Author_Institution :
Digital DNA Labs., Motorola, Austin, TX, USA
Abstract :
Silicon on insulator (SOI) technology has gained interest to provide improvements in speed and power consumption over bulk technologies. However, floating body effects of SOI devices such as kinks, parasitic bipolar action and hysteretic propagation delay have retarded its application. To eliminate these undesirable effects several body-tied structures have been suggested, but all generally suffer from adverse costs such as performance degradation and/or process complexity. We propose a novel body-tied structure, adding simple partial trench isolation, which effectively suppresses the floating body effects without performance degradation.
Keywords :
MOSFET; scanning electron microscopy; semiconductor device measurement; silicon-on-insulator; PTIBT; SOI applications; floating body effect suppression; floating body effects; hysteretic propagation delay; kinks; parasitic bipolar action; partial trench isolated body-tied structure; silicon on insulator; CMOS process; CMOS technology; Capacitance; DNA; Degradation; Energy consumption; Etching; Isolation technology; Laboratories; Silicon on insulator technology;
Conference_Titel :
SOI Conference, 2001 IEEE International
Conference_Location :
Durango, CO, USA
Print_ISBN :
0-7803-6739-1
DOI :
10.1109/SOIC.2001.957990