DocumentCode
1669066
Title
Magnetic tunnel junction magnetic field sensor design tool
Author
Li, Ronald C L ; Unguris, J. ; Edelstein, Alan S. ; Burnette, J.E. ; Fischer, G.A. ; Nowak, Edmund R. ; Egelhoff, William F. ; Pong, Philip W T
Author_Institution
Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
fYear
2010
Firstpage
1149
Lastpage
1150
Abstract
Design ToolA spreadsheet-based magnetic tunnel junction (MTJ) sensor design tool is presented in this paper. The system is developed using Excel and Visual Basic Application. It allows users to optimize the various parameters of the sensor design with the goal of SQUID-like sensitivity. Users can input parameters of the design including magnetic properties, junction areas, and free layers thicknesses. The design tool will then calculate and display automatically various noise sources including Johnson noise, shot noise, 1/f noise, and thermal magnetic noise that must be considered when building MTJ magnetic field sensors. Graphs predicting the sensitivities, operating current and power of the finished sensors are shown and fine tuning of each design parameter is allowed using the scrollbars provided. Using this design tool, effects of changes made to any design parameter can be clearly observed and detailed noise analysis can be studied without manually repeating complex calculations.
Keywords
1/f noise; Visual BASIC; computerised instrumentation; magnetic noise; magnetic sensors; magnetic tunnelling; shot noise; spreadsheet programs; thermal noise; 1-f noise; Excel; Johnson noise; MTJ; SQUID-like sensitivity; Visual Basic; free layer thicknesses; junction areas; magnetic field sensors; magnetic properties; magnetic tunnel junction; shot noise; spreadsheet-based design tool; thermal magnetic noise; Buildings; Design optimization; Displays; Magnetic analysis; Magnetic noise; Magnetic properties; Magnetic sensors; Magnetic tunneling; Thermal sensors; Visual BASIC;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424981
Filename
5424981
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