DocumentCode
1669153
Title
Ar implantation effects in SOI NMOSFET´s under low voltage operation
Author
Shino, T. ; Nii, H. ; Kawanaka, S. ; Inoh, K. ; Katsumata, Y. ; Yoshimi, M. ; Ishiuchi, H.
Author_Institution
Syst. LSI Res. & Dev. Center, Toshiba Corp., Yokohama, Japan
fYear
2001
Firstpage
89
Lastpage
90
Abstract
To reduce the parasitic bipolar gain of an SOI device, several techniques have been proposed. This paper reveals the advantage and disadvantage of Ar implant plus shallow S/D technique, highlighting process, temperature. and frequency dependent device characteristics of V/sub D/ below 1.5V.
Keywords
MOSFET; argon; elemental semiconductors; ion implantation; semiconductor device measurement; silicon; silicon compounds; silicon-on-insulator; 1.5 V; Ar implant; Ar implantation effects; SOI NMOSFETs; Si:Ar-SiO/sub 2/; frequency dependent device characteristics; low voltage operation; parasitic bipolar gain; process dependent device characteristics; shallow S/D technique; temperature dependent device characteristics; Argon; Capacitance; History; Impact ionization; Implants; Lighting; Low voltage; MOSFET circuits; Temperature dependence; Virtual colonoscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2001 IEEE International
Conference_Location
Durango, CO, USA
ISSN
1078-621X
Print_ISBN
0-7803-6739-1
Type
conf
DOI
10.1109/SOIC.2001.957999
Filename
957999
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