• DocumentCode
    1669153
  • Title

    Ar implantation effects in SOI NMOSFET´s under low voltage operation

  • Author

    Shino, T. ; Nii, H. ; Kawanaka, S. ; Inoh, K. ; Katsumata, Y. ; Yoshimi, M. ; Ishiuchi, H.

  • Author_Institution
    Syst. LSI Res. & Dev. Center, Toshiba Corp., Yokohama, Japan
  • fYear
    2001
  • Firstpage
    89
  • Lastpage
    90
  • Abstract
    To reduce the parasitic bipolar gain of an SOI device, several techniques have been proposed. This paper reveals the advantage and disadvantage of Ar implant plus shallow S/D technique, highlighting process, temperature. and frequency dependent device characteristics of V/sub D/ below 1.5V.
  • Keywords
    MOSFET; argon; elemental semiconductors; ion implantation; semiconductor device measurement; silicon; silicon compounds; silicon-on-insulator; 1.5 V; Ar implant; Ar implantation effects; SOI NMOSFETs; Si:Ar-SiO/sub 2/; frequency dependent device characteristics; low voltage operation; parasitic bipolar gain; process dependent device characteristics; shallow S/D technique; temperature dependent device characteristics; Argon; Capacitance; History; Impact ionization; Implants; Lighting; Low voltage; MOSFET circuits; Temperature dependence; Virtual colonoscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2001 IEEE International
  • Conference_Location
    Durango, CO, USA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-6739-1
  • Type

    conf

  • DOI
    10.1109/SOIC.2001.957999
  • Filename
    957999