Title :
HDL and integrating system-level simulation technologies
Author :
Ussery, C. ; McKinley, Kathy ; Lang, Kathy ; Komp, Ed ; Larue, Woody
Author_Institution :
Cadence Design Syst., USA
Abstract :
System level design is a critical component of any electronics product development project. However, HDL based ASIC design has remained a distinctive and separate function within projects. With the advent of deep submicron technology, large systems and subsystems can now be placed on a single chip. This requires a closer interaction between system level design and ASIC development. The paper describes an effective methodology and technology support for integrating system level simulation techniques with HDL based simulation to provide a smooth transition between each level. We start by examining an integrated verification methodology and the use models for utilizing mixed dataflow and HDL models. We then discuss combining a model of interaction derived from the work done on the Ptolemy project with a standards based implementation approach using the Open Model Forum (OMF) standard. Finally, an example is used to highlight the effectiveness of this approach
Keywords :
application specific integrated circuits; circuit analysis computing; digital simulation; hardware description languages; HDL based ASIC design; HDL based simulation; Open Model Forum standard; Ptolemy project; deep submicron technology; electronics product development project; integrated verification methodology; mixed dataflow/HDL models; standards based implementation approach; system level design; system level simulation techniques; system level simulation technology integration; use models; Algorithm design and analysis; Analytical models; Application specific integrated circuits; Computational modeling; Computer architecture; Encapsulation; Hardware design languages; Product development; System-level design; System-on-a-chip;
Conference_Titel :
Verilog HDL Conference, 1997., IEEE International
Conference_Location :
Santa Clare, CA
Print_ISBN :
0-8186-7955-7
DOI :
10.1109/IVC.1997.588540