IGBT-Modules: Design for reliability

Author

Lutz, Josef

Author_Institution

Dept. of Power Electron., Chemnitz Univ. of Technol., Chemnitz, Germany

fYear

2009

Firstpage

1

Lastpage

3

Abstract

In several IGBT applications, power cycling capability of the modules determines the lifetime of the device under given conditions. Modern power modules are manufactured in typical structures; in focus are standard modules with Al₂O₃ ceramics. Weak points regarding the module lifetime are the substrate solder joint, the chip solder and the bond wires. Typical failure mechanisms of these interconnection layers are shown. Thermo-mechanical simulations are used to find the deformations and the points of maximal strain and stress. Aging mechanisms are not independent. Based on a large number of power cycling results, an equation for power cycling lifetime was derived and published at the CIPS 08 conference. The presentation will discuss some application examples and the estimated lifetime using the CIPS 08 model.

Keywords

ageing; aluminium compounds; ceramics; deformation; insulated gate bipolar transistors; integrated circuit interconnections; integrated circuit reliability; soldering; Al₂O₃; CIPS 08 conference; IGBT modules; aging; bond wires; ceramics; chip solder; deformations; interconnection layers; power cycling capability; power modules; reliability design; substrate solder joint; thermo-mechanical simulations; Bonding; Ceramics; Deformable models; Failure analysis; Insulated gate bipolar transistors; Manufacturing; Multichip modules; Soldering; Thermomechanical processes; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Applications, 2009. EPE '09. 13th European Conference on

Conference_Location

Barcelona

Print_ISBN

978-1-4244-4432-8

Electronic_ISBN

978-90-75815-13-9

Type

conf

Filename

5279091