Increasing component reliability by eliminating solder interfaces

▪ Base plates are difficult to optimize for large footprint modules. ▪ The thermal impedance of non base plate modules is only a disadvantage for small duty cycles. ▪ Pressure contact modules with multiple load terminals eliminate the need for load terminal soldering. ▪ The Ag sinter technology is a superior bond technology for the chip-to-substrate interconnection. ▪ The 100% solder-free module design combines these advantages in one package — it has a high potential for increased reliability under temperature cycling.