The Application of Metal Deposition in Optical Sensor Technique. The Microscale Cu Deposition as “Electrochemical Welding”

Author

Sanecki, Przemyslaw T. ; Gibala, Katarzyna ; Skital, Piotr M.

Author_Institution

Fac. of Chem., Rzeszow Univ. of Technol., Rzeszow, Poland

Volume

15

Issue

2

fYear

2015

fDate

Feb. 2015

Firstpage

1275

Lastpage

1279

Abstract

The problem of how to attach an optical glass fiber to a copper plate was solved with the use of microscale electrolyser of special design. The respective laboratory scale technology was presented. The results were documented by photos of ready elements. The matter of relation between deposition by means of constant current electrolysis without potential control and the process realized with the use of cyclic voltammetry and chronopotentiometry techniques was raised and discussed.

Keywords

copper; electrodeposition; fibre optic sensors; voltammetry (chemical analysis); welding; Cu; chronopotentiometry; copper plate; cyclic voltammetry; electrochemical welding; metal deposition; microscale Cu deposition; microscale electrolyser; optical glass fiber; optical sensor technique; Copper; Electrodes; Optical fiber sensors; Optical fibers; Surface treatment; Chronopotentiometry (CP); Optical fiber sensor; cyclic voltammetry (CV); fiber loaded diaphragm; flat diaphragm; metal deposition; packed-bed micro-electrolyser; solid electrodes;

fLanguage

English

Journal_Title

Sensors Journal, IEEE

Publisher

ieee

ISSN

1530-437X

Type

jour

DOI

10.1109/JSEN.2014.2345731

Filename

6873231