A 3D integration scheme utilizing wireless interconnections for implementing hyper brains

Author

Iwata, Atsushi ; Sasaki, Mamoru ; Kikkawa, Takamaro ; Kameda, Seiji ; Ando, Hiroshi ; Kimoto, Kentaro ; Arizono, Daisuke ; Sunami, Hideo

Author_Institution

Hiroshima Univ., Higashi-Hiroshima, Japan

fYear

2005

Firstpage

262

Abstract

A 3D integration custom stack system utilizing a local wireless interconnect (LWI) and a global wireless interconnect (GWI) is proposed. The LWI transfers Gb/s pulses using resonant coupling of spiral inductors with low-power dissipation of several mW. The GWI transfers global clocks and data on a 20 GHz signal using on-chip antennas.

Keywords

application specific integrated circuits; clocks; inductors; integrated circuit interconnections; low-power electronics; microwave antennas; wireless sensor networks; 20 GHz; 3D integration custom stack system; 3D integration scheme; GWI; LWI; global clocks; global data; global wireless interconnect; hyper brain implementation; local wireless interconnect; low-power dissipation; on-chip antennas; resonant coupling; spiral inductors; wireless interconnections; CMOS technology; Clocks; Computer architecture; Inductors; Integrated circuit interconnections; Power dissipation; Power system interconnection; Pulse width modulation; Spirals; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International

Conference_Location

San Francisco, CA

ISSN

0193-6530

Print_ISBN

0-7803-8904-2

Type

conf

DOI

10.1109/ISSCC.2005.1493969

Filename

1493969