Use of flat miniature heat pipes for the thermal management of electronic packages

Author

Zaghdoudi, Mohamed Chaker ; Tantolin, Christian ; Sarno, Claude

Author_Institution

Unite de Rech. Mater., Mesures et Applic. (MMA), Inst. Nat. des Sci. Appl. et de Technol., Tunis, Tunisia

fYear

2011

Firstpage

1

Lastpage

11

Abstract

An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrates are considered: alumina and FR4 epoxy, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.

Keywords

chip-on-board packaging; cooling; heat pipes; temperature measurement; thermal management (packaging); FR4 epoxy; alumina epoxy; chip-on-board technology; chip-on-the-card technology; cooling high power dissipation electronic cards; electronic packages; flat miniature heat pipes; maximum chip temperature; temperature gradients; thermal management; thermal measurements; Electronic packaging thermal management; Heat sinks; Heat transfer; Heating; Thermal resistance; Electronic Packages; Electronics Cooling; Miniature Heat Pipes; Thermal Management;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics (ICM), 2011 International Conference on

Conference_Location

Hammamet

Print_ISBN

978-1-4577-2207-3

Type

conf

DOI

10.1109/ICM.2011.6177422

Filename

6177422