Title :
Preparation and dielectric properties of epoxy/silica nanocomposites
Author :
Shi, Huicheng ; Gao, Naikui ; Jin, Haiyun ; Chen, Bangfa ; Zhang, Gang
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ., Xi´´an, China
Abstract :
In this paper, epoxy resin based composites filled with nano-silica were fabricated. The relationships between the dielectric properties as well as glass transition temperature (Tg) and nano-filler content were investigated. The results showed that, relative permittivity (¿r) and dielectric loss tangent (tan¿) decreased when filler content was no more than 0.3 wt.%, and reached minimum value at 0.3 wt.%, but above this filler loading, ¿r and tan¿ started to increase with increasing filler content. The DC volume resistivity decreased with the introduction of nano-silica, and the value of Tg did not appear to change significantly with filler content.
Keywords :
dielectric losses; electrical resistivity; filled polymers; glass transition; nanocomposites; permittivity; resins; silicon compounds; DC volume resistivity; SiO2; dielectric loss tangent; epoxy-silica nanocomposites; glass transition temperature; nanofiller; nanosilica; relative permittivity; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Dielectrics and electrical insulation; Epoxy resins; Frequency; Nanocomposites; Permittivity measurement; Silicon compounds; Temperature;
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
DOI :
10.1109/INEC.2010.5425080
