• DocumentCode
    1671890
  • Title

    Preparation and dielectric properties of epoxy/silica nanocomposites

  • Author

    Shi, Huicheng ; Gao, Naikui ; Jin, Haiyun ; Chen, Bangfa ; Zhang, Gang

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ., Xi´´an, China
  • fYear
    2010
  • Firstpage
    999
  • Lastpage
    1000
  • Abstract
    In this paper, epoxy resin based composites filled with nano-silica were fabricated. The relationships between the dielectric properties as well as glass transition temperature (Tg) and nano-filler content were investigated. The results showed that, relative permittivity (¿r) and dielectric loss tangent (tan¿) decreased when filler content was no more than 0.3 wt.%, and reached minimum value at 0.3 wt.%, but above this filler loading, ¿r and tan¿ started to increase with increasing filler content. The DC volume resistivity decreased with the introduction of nano-silica, and the value of Tg did not appear to change significantly with filler content.
  • Keywords
    dielectric losses; electrical resistivity; filled polymers; glass transition; nanocomposites; permittivity; resins; silicon compounds; DC volume resistivity; SiO2; dielectric loss tangent; epoxy-silica nanocomposites; glass transition temperature; nanofiller; nanosilica; relative permittivity; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Dielectrics and electrical insulation; Epoxy resins; Frequency; Nanocomposites; Permittivity measurement; Silicon compounds; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5425080
  • Filename
    5425080