DocumentCode
1672646
Title
Hydrogen diffusion and redistribution in PECVD Si-rich silicon nitride during rapid thermal annealing
Author
He, S.S. ; Shannon, V.L.
Author_Institution
Sharp Microelectron. Technol. Inc., Camas, WA, USA
fYear
1995
Firstpage
269
Lastpage
271
Abstract
We have studied hydrogen release and movement in Si-rich PECVD nitride films as a result of a Rapid Thermal Anneal (RTA) process at varying temperatures. Combined with FTIR and Hydrogen Forward Spectrum, we studied the changes of hydrogen concentration and bonding configuration of the silicon nitride during RTA. We have found that during RTA some of NH bonds are converted to SiH bonds as well as hydrogen out diffusion from both SiH and NH bonds. Hydrogen diffusion coefficients of the silicon nitride are determined
Keywords
Fourier transform spectra; bonds (chemical); dielectric thin films; diffusion; hydrogen; impurities; impurity distribution; infrared spectra; plasma CVD coatings; rapid thermal annealing; silicon compounds; FTIR spectrum; PECVD silicon nitride film; SiN:H; bonding; hydrogen diffusion; hydrogen forward spectrum; hydrogen redistribution; rapid thermal annealing; Absorption; Bonding; Curve fitting; Hydrogen; Rapid thermal annealing; Semiconductor films; Silicon; Testing; Thickness measurement; Variable speed drives;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-3062-5
Type
conf
DOI
10.1109/ICSICT.1995.500083
Filename
500083
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