• DocumentCode
    1672646
  • Title

    Hydrogen diffusion and redistribution in PECVD Si-rich silicon nitride during rapid thermal annealing

  • Author

    He, S.S. ; Shannon, V.L.

  • Author_Institution
    Sharp Microelectron. Technol. Inc., Camas, WA, USA
  • fYear
    1995
  • Firstpage
    269
  • Lastpage
    271
  • Abstract
    We have studied hydrogen release and movement in Si-rich PECVD nitride films as a result of a Rapid Thermal Anneal (RTA) process at varying temperatures. Combined with FTIR and Hydrogen Forward Spectrum, we studied the changes of hydrogen concentration and bonding configuration of the silicon nitride during RTA. We have found that during RTA some of NH bonds are converted to SiH bonds as well as hydrogen out diffusion from both SiH and NH bonds. Hydrogen diffusion coefficients of the silicon nitride are determined
  • Keywords
    Fourier transform spectra; bonds (chemical); dielectric thin films; diffusion; hydrogen; impurities; impurity distribution; infrared spectra; plasma CVD coatings; rapid thermal annealing; silicon compounds; FTIR spectrum; PECVD silicon nitride film; SiN:H; bonding; hydrogen diffusion; hydrogen forward spectrum; hydrogen redistribution; rapid thermal annealing; Absorption; Bonding; Curve fitting; Hydrogen; Rapid thermal annealing; Semiconductor films; Silicon; Testing; Thickness measurement; Variable speed drives;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-3062-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.1995.500083
  • Filename
    500083