Title :
Hydrogen diffusion and redistribution in PECVD Si-rich silicon nitride during rapid thermal annealing
Author :
He, S.S. ; Shannon, V.L.
Author_Institution :
Sharp Microelectron. Technol. Inc., Camas, WA, USA
Abstract :
We have studied hydrogen release and movement in Si-rich PECVD nitride films as a result of a Rapid Thermal Anneal (RTA) process at varying temperatures. Combined with FTIR and Hydrogen Forward Spectrum, we studied the changes of hydrogen concentration and bonding configuration of the silicon nitride during RTA. We have found that during RTA some of NH bonds are converted to SiH bonds as well as hydrogen out diffusion from both SiH and NH bonds. Hydrogen diffusion coefficients of the silicon nitride are determined
Keywords :
Fourier transform spectra; bonds (chemical); dielectric thin films; diffusion; hydrogen; impurities; impurity distribution; infrared spectra; plasma CVD coatings; rapid thermal annealing; silicon compounds; FTIR spectrum; PECVD silicon nitride film; SiN:H; bonding; hydrogen diffusion; hydrogen forward spectrum; hydrogen redistribution; rapid thermal annealing; Absorption; Bonding; Curve fitting; Hydrogen; Rapid thermal annealing; Semiconductor films; Silicon; Testing; Thickness measurement; Variable speed drives;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-3062-5
DOI :
10.1109/ICSICT.1995.500083