Title :
Optimally selecting packaging technologies and circuit partitions based on cost and performance
Author :
Jacobsen, John B. ; Hopkins, Douglas C.
Author_Institution :
Dept. of Packaging, Grundfos A/S, Bjerringbro, Denmark
fDate :
6/22/1905 12:00:00 AM
Abstract :
Most power electronics circuits are packaged using two or more power electronics packaging technologies. To optimally select and use several technologies that meet performance requirements at minimum cost requires a strategic partitioning of the circuit. Presented is a structured technique for optimally selecting technologies based on a relative cost diagram. Other factors, such as performance, product volume and modularity are included
Keywords :
AC motor drives; power electronics; semiconductor device packaging; AC motor drive module; circuit partitions; electronics packaging technologies; minimum cost; optimal packaging selection; packaging technologies; performance requirements; power electronics circuits; product volume; relative cost diagram; strategic partitioning; Circuits; Cost function; Electronic packaging thermal management; Electronics packaging; Energy management; Jacobian matrices; Power electronics; Power supplies; Surface-mount technology; Technology management;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE
Conference_Location :
New Orleans, LA
Print_ISBN :
0-7803-5864-3
DOI :
10.1109/APEC.2000.826079
