• DocumentCode
    1673742
  • Title

    Impact of thermal cycle on end-face geometry of laser processed LC and standard LC connectors

  • Author

    Thongdaeng, R. ; Wangsan, S. ; Berdinskikh, Tatiana ; Suurmann, R. ; Culbert, J.M. ; Hogberg, D.

  • Author_Institution
    Optronics Lab., Celestica Thailand, Chonburi, Thailand
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper investigates the impact of thermal cycle on geometry of laser processed and standard LC/PC connectors. All connectors were separated into four groups: 1) unmated & stored at room temperature, 2) mated & stored at room temperature, 3) unmated during thermal cycle, and 4) mated during thermal cycle. Groups 1 & 2 were stored at room temperature for 7 days. The thermal cycle was performed on Groups 3 & 4 during 7 days based on GR-326 requirements. Radius of curvature, apex offset and fiber height were measured before and after those 7 days. The fiber withdrawal up to 100 nm is found in Group 4, but no changes are observed in Groups 1-3. After Group 4 underwent the 2nd and 3rd thermal cycles (1 week/cycle), an insignificant change in fiber height is found. In addition, there is no significant change in fiber height for the unmated connectors in Group 4 after 1 year stored at room temperature.
  • Keywords
    geometrical optics; laser materials processing; LC/PC connectors; end-face geometry; laser processed LC; standard LC connectors; temperature 293 K to 298 K; thermal cycle; time 7 day; Fiber Withdrawal; Laser Processed LC connector; Thermal Cycle Test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Communications and Networks (ICOCN), 2012 11th International Conference on
  • Conference_Location
    Chonburi
  • Print_ISBN
    978-1-4673-4957-4
  • Electronic_ISBN
    978-1-4673-4958-1
  • Type

    conf

  • DOI
    10.1109/ICOCN.2012.6486231
  • Filename
    6486231