Title :
RF modeling of ball grid array packages using a coupled transmission line model
Author :
Lai, Yeong-Lin ; Wu, Chia-Long ; Chiang, Kevin
Author_Institution :
Dept. of Mechatronics Eng., Nat. Changhua Univ. of Educ., Taiwan
Abstract :
A novel method for radio-frequency (RF) modeling of ball grid array (BGA) packages is presented. A new analytical method is developed to extract the inductance characteristics of the package bond wires. With the extracted bond wire data, a cascaded multi-section coupled transmission line model is setup to describe the physical trace structures of the BGA packages. The multi-section π model representing the coupled transmission line effect of the signal traces is used for the RF modeling of the BGA packages. The BGA packages with open-path, short-path, through-path, and through-ground test configurations are studied. The simulated S parameter results exhibit very good agreement with the measured ones for the BGA packages.
Keywords :
S-parameters; ball grid arrays; coupled transmission lines; inductance; integrated circuit packaging; modelling; radiofrequency integrated circuits; transmission line theory; BGA packages; RF modeling; ball grid array packages; bond wire data; cascaded multi-section line model; coupled transmission line model; inductance characteristics; multi-section π model; package bond wires; physical signal trace structures; radio-frequency modeling; Bonding; Couplings; Data mining; Electronics packaging; Inductance; RF signals; Radio frequency; Testing; Transmission lines; Wires;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE
Print_ISBN :
0-7803-7694-3
DOI :
10.1109/RFIC.2003.1213960
