Title :
Evaluation of metal post interconnected parallel plate structure for power electronic building blocks
Author :
Siddabattula, Kalyan ; Chen, Zhou ; Boroyevich, Dushan
Author_Institution :
Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fDate :
6/22/1905 12:00:00 AM
Abstract :
This paper evaluates metal post interconnected parallel plate structure (MPIPPS) adopted for the power electronic building blocks (PEBB) packaging program in terms of parasitic elements involved in the layout design, current distribution and its impact on electrical performance. It also compares this technology with the more conventional wire-bond technology. Electrical performance predicted by INCA, Maxwell, and PSPICE is verified with an experimental setup
Keywords :
packaging; power electronics; INCA; Maxwell; PSPICE; electrical performance; metal post interconnected parallel plate structure; packaging program; parasitic elements; power electronic building blocks; wire-bond technology; Conducting materials; Current distribution; Diodes; Electronic packaging thermal management; Inductance; Inverters; Power electronics; Power system interconnection; Switches; Voltage;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE
Conference_Location :
New Orleans, LA
Print_ISBN :
0-7803-5864-3
DOI :
10.1109/APEC.2000.826115
