Title :
Thermal management of power electronics modules via acoustic micrography imaging
Author :
Haque, Shatil ; Liu, Xingsheng ; Lu, G.-Q. ; Goings, John
Author_Institution :
Power Electron. Packaging Lab., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fDate :
6/22/1905 12:00:00 AM
Abstract :
Acoustic micrography imaging is introduced to detect cracks, voids, porosity, coplanarity and delamination at the power module-heat spreader interface. Interfacial defect contents are correlated with measured thermal resistance to establish packaging guidelines for enhanced thermal management of power modules with an optimized bonding process of selected interface materials with minimized defects
Keywords :
acoustic imaging; crack detection; delamination; modules; porosity; power electronics; thermal management (packaging); thermal resistance measurement; voids (solid); acoustic micrography imaging; coplanarity detection; cracks detection; delamination detection; enhanced thermal management; interfacial defect contents; optimized bonding process; porosity detection; power electronics modules; power module-heat spreader interface; power modules; selected interface materials; thermal management; thermal resistance measurement; voids detection; Acoustic imaging; Acoustic signal detection; Electronic packaging thermal management; Energy management; Multichip modules; Photomicrography; Power electronics; Thermal management; Thermal management of electronics; Thermal resistance;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE
Conference_Location :
New Orleans, LA
Print_ISBN :
0-7803-5864-3
DOI :
10.1109/APEC.2000.826119
