Thermal management of power electronics modules via acoustic micrography imaging

Author

Haque, Shatil ; Liu, Xingsheng ; Lu, G.-Q. ; Goings, John

Author_Institution

Power Electron. Packaging Lab., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

1

fYear

2000

fDate

6/22/1905 12:00:00 AM

Firstpage

299

Abstract

Acoustic micrography imaging is introduced to detect cracks, voids, porosity, coplanarity and delamination at the power module-heat spreader interface. Interfacial defect contents are correlated with measured thermal resistance to establish packaging guidelines for enhanced thermal management of power modules with an optimized bonding process of selected interface materials with minimized defects

Keywords

acoustic imaging; crack detection; delamination; modules; porosity; power electronics; thermal management (packaging); thermal resistance measurement; voids (solid); acoustic micrography imaging; coplanarity detection; cracks detection; delamination detection; enhanced thermal management; interfacial defect contents; optimized bonding process; porosity detection; power electronics modules; power module-heat spreader interface; power modules; selected interface materials; thermal management; thermal resistance measurement; voids detection; Acoustic imaging; Acoustic signal detection; Electronic packaging thermal management; Energy management; Multichip modules; Photomicrography; Power electronics; Thermal management; Thermal management of electronics; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE

Conference_Location

New Orleans, LA

Print_ISBN

0-7803-5864-3

Type

conf

DOI

10.1109/APEC.2000.826119

Filename

826119