DocumentCode
1675491
Title
Design techniques to combat process, temperature and supply variations in Bluetooth RFIC
Author
Tee, Y. Theng ; Seng, Y. Hwa ; Boon, L. Poh ; Hung, T. Kwang ; Tachi, S. ; Ling, K. Soo ; Murakami, T. ; Hui, S. Jin ; Tiong, L. Choon ; Choon, T. Lin ; Kheng, W. Wing ; Jun, X. Qi ; Meng, L. Chiao ; Hwi, L. Shio ; Wei, X. ; Itoh, M.
Author_Institution
RFIC Dev. & Design Dept., OKI Techno Centre (Singapore) Pte Ltd, Singapore, Singapore
fYear
2003
Firstpage
551
Lastpage
554
Abstract
A fully integrated Bluetooth RF transceiver with sensitivity up to -85 dBm with ±2 dB process variation has been achieved. The sensitivity only varies ±1 dB from 2.7 to 3.3V and ±1.5 dB from -10 to +90°C. This RFIC is fabricated using a 0.35μm CMOS process and can withstand a maximum input power of +5 dBm for 0.1% BER.
Keywords
Bluetooth; CMOS analogue integrated circuits; UHF integrated circuits; compensation; integrated circuit noise; transceivers; -10 to 90 degC; 0.35 micron; 2.7 to 3.3 V; BER; Bluetooth RFIC; CMOS; RF transceiver; maximum input power; process variation; sensitivity; Bluetooth; CMOS process; Filters; Radio frequency; Radiofrequency integrated circuits; Signal processing; Switches; Temperature sensors; Transceivers; Voltage-controlled oscillators;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE
ISSN
1529-2517
Print_ISBN
0-7803-7694-3
Type
conf
DOI
10.1109/RFIC.2003.1214006
Filename
1214006
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