Title :
Al-SiO/sub 2/-Al sandwich microstrip lines for on-chip interconnects up to 400 GHz
Author :
von Kamienski, E.S. ; Gondermann, J. ; Roskos, H.G. ; Kurz, H.
Author_Institution :
Inst. fuer Halbleitertechnik, RWTH, Aachen, Germany
Abstract :
A downscaled 2- mu m-wide microstrip line fabricated with both signal and ground conductors on top of the substrate is presented. A significantly reduced geometric dispersion for 400-GHz bandwidth pulse was measured on this waveguide, using the time-resolved electrooptic sampling technique. The mode of the electromagnetic signal is strongly confined, promising reduced crosstalk between densely packed interconnects.<>
Keywords :
aluminium; crosstalk; metallisation; microstrip lines; silicon compounds; 400 GHz; Al-SiO/sub 2/-Al; crosstalk; densely packed interconnects; electromagnetic signal; geometric dispersion; ground conductors; microstrip line; on-chip interconnects; signal conductors; time-resolved electrooptic sampling technique; Bandwidth; Conductors; Crosstalk; Dispersion; Electromagnetic measurements; Electromagnetic waveguides; Electrooptical waveguides; Microstrip; Pulse measurements; Sampling methods;
Conference_Titel :
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-1209-0
DOI :
10.1109/MWSYM.1993.276795
