Multiple-chip module design optimizations using a novel layout parameterization technique

Author

Huang, Chun-Wen Paul ; Dow, G. Samuel ; Bao, Jianwen ; Kuran, Shihab ; Sercu, Jeannick

Author_Institution

Anadigics Inc., Warren, NJ, USA

fYear

2003

Firstpage

587

Lastpage

590

Abstract

A novel layout parameterization technique for multi-chip module design optimizations is presented. This technique is based on a quasi-static method of moments and multi-dimensional interpolation, which can reduce a 12-minute electromagnetic layout simulation to 5.3 seconds. Excellent CDMA power amplifier (PA) module performance is achieved based on this technique.

Keywords

circuit optimisation; code division multiple access; integrated circuit layout; interpolation; method of moments; multichip modules; power amplifiers; CDMA power amplifier; design optimization; electromagnetic layout simulation; layout parameterization; multi-dimensional interpolation; multiple-chip module; quasi-static method of moments; Circuit optimization; Circuit simulation; Design optimization; Integrated circuit modeling; Interpolation; Microwave circuits; Moment methods; Multiaccess communication; Radio frequency; Scattering parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE

ISSN

1529-2517

Print_ISBN

0-7803-7694-3

Type

conf

DOI

10.1109/RFIC.2003.1214015

Filename

1214015

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1675716