Title :
Multiple-chip module design optimizations using a novel layout parameterization technique
Author :
Huang, Chun-Wen Paul ; Dow, G. Samuel ; Bao, Jianwen ; Kuran, Shihab ; Sercu, Jeannick
Author_Institution :
Anadigics Inc., Warren, NJ, USA
Abstract :
A novel layout parameterization technique for multi-chip module design optimizations is presented. This technique is based on a quasi-static method of moments and multi-dimensional interpolation, which can reduce a 12-minute electromagnetic layout simulation to 5.3 seconds. Excellent CDMA power amplifier (PA) module performance is achieved based on this technique.
Keywords :
circuit optimisation; code division multiple access; integrated circuit layout; interpolation; method of moments; multichip modules; power amplifiers; CDMA power amplifier; design optimization; electromagnetic layout simulation; layout parameterization; multi-dimensional interpolation; multiple-chip module; quasi-static method of moments; Circuit optimization; Circuit simulation; Design optimization; Integrated circuit modeling; Interpolation; Microwave circuits; Moment methods; Multiaccess communication; Radio frequency; Scattering parameters;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE
Print_ISBN :
0-7803-7694-3
DOI :
10.1109/RFIC.2003.1214015
