DocumentCode
167586
Title
The Power-Performance Tradeoffs of the Intel Xeon Phi on HPC Applications
Author
Bo Li ; Hung-Ching Chang ; Shuaiwen Song ; Chun-Yi Su ; Meyer, Timmy ; Mooring, John ; Cameron, Kirk W.
Author_Institution
Virginia Tech, Blacksburg, VA, USA
fYear
2014
fDate
19-23 May 2014
Firstpage
1448
Lastpage
1456
Abstract
Accelerators are used in about 13% of the current Top500 List. Supercomputers leveraging accelerators grew by a factor of 2.2x in 2012 and are expected to completely dominate the Top500 by 2015. Though most of these deployments use NVIDIA GPGPU accelerators, Intel´s Xeon Phi architecture will likely grow in popularity in the coming years. Unfortunately, there are few studies analyzing the performance and energy efficiency of systems leveraging the Intel Xeon Phi. We extend our systemic measurement methodology to isolate system power by component including accelerators. We use this methodology to present a detailed study of the performance-energy tradeoffs of the Xeon Phi architecture. We demonstrate the portability of our approach by comparing our Xeon Phi results to the Intel multicore Sandy Bridge host processor and the NVIDIA Tesla GPU for a wide range of HPC applications. Our results help explain limitations in the power-performance scalability of HPC applications on the current Intel Xeon Phi architecture.
Keywords
energy conservation; mainframes; microprocessor chips; multiprocessing systems; parallel machines; HPC applications; Intel Xeon Phi architecture; Intel multicore; Intel´s Xeon Phi architecture; NVIDIA GPGPU accelerators; NVIDIA Tesla GPU; Sandy Bridge host processor; Top500 List; energy efficiency; isolate system power; power-performance tradeoffs; supercomputers leveraging accelerators; systemic measurement; Benchmark testing; Computer architecture; Data transfer; Instruction sets; Kernel; Power measurement; Rails; Intel Xeon Phi; Performance; Power;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel & Distributed Processing Symposium Workshops (IPDPSW), 2014 IEEE International
Conference_Location
Phoenix, AZ
Print_ISBN
978-1-4799-4117-9
Type
conf
DOI
10.1109/IPDPSW.2014.162
Filename
6969548
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