Title :
PDM-based system for manufacturing process analysis and optimization
Author :
El-Mounayri, Hazim ; Zhang, Jiyu ; Chen, Jie
Author_Institution :
Purdue Sch. of Eng. & Technol., IUPUI, West Lafayette, IN, USA
fDate :
6/21/1905 12:00:00 AM
Abstract :
A PDM-based system for manufacturing process analysis and optimization is presented in this paper. The system consists of a standard (commercial) CAD/CAE/CAM system integrated with a PDM (product data management) module. The resulting system is then augmented with additional virtual models, some of which are available commercially and others developed by the authors. The final system allows for the simulation and evaluation of engineering products and systems that involve both mechanical and electrical components. The simulation is more comprehensive allowing for an evaluation that is more accurate and reliable than one achieved using existing state-of-the-art CAD/CAE/CAM/PDM systems. In particular, the extended virtual manufacturing capabilities allow for an accurate prediction of the different machining process parameters. The details of the development, as well as the work accomplished to date to test and validate the extended machining modeling and simulation capabilities, are presented
Keywords :
CAD/CAM; computer aided engineering; machining; manufacture; product development; CAD/CAE/CAM system; electrical components; engineering products evaluation; engineering products simulation; extended virtual manufacturing capabilities; geometric modelling; machining process parameters; manufacturing process analysis; manufacturing process optimization; mechanical components; milling; product data management module; virtual models; CADCAM; Computer aided engineering; Computer aided manufacturing; Concurrent engineering; Design automation; Machining; Manufacturing processes; Product development; Solid modeling; Virtual manufacturing;
Conference_Titel :
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
Conference_Location :
Cincinnati, OH
Print_ISBN :
0-7803-5757-4
DOI :
10.1109/EEIC.1999.826173