• DocumentCode
    1676052
  • Title

    Aging studies for estimating the life of weapon grade magnetic components

  • Author

    Archer, Wendel E. ; Sanchez, Robert O.

  • Author_Institution
    Interconnects Dept., Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    33
  • Lastpage
    37
  • Abstract
    In order to determine if the life of fielded weapons can be extended, Sandia National Laboratories (SNL) is investigating the long-term reliability of weapon systems´ components. The new stockpile program hopes to extend the life by proving that the systems will last longer than the initial design required. A small part of this program is a study of the long-term reliability of magnetic components. There are more than 100 designs of magnetic components that are used in weapon sub-systems. The authors present data and failure mode information on several components that are representative of best and worst designs for long-term reliability. Sandia has aged these parts through temperature cycling and elevated temperatures. The results are used to estimate long-term reliability and to develop models for reliability analysis. The important component parameters that affect system performance are highlighted
  • Keywords
    ageing; failure analysis; magnetic devices; reliability; weapons; Sandia National Laboratories; aging studies; elevated temperatures; life estimation; long-term reliability; reliability analysis; stockpile program; temperature cycling; weapon grade magnetic components; weapon systems´ components; Aging; Inductance; Life estimation; Power transformers; Pulse transformers; Temperature; Testing; Toroidal magnetic fields; Transformer cores; Weapons;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
  • Conference_Location
    Cincinnati, OH
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-5757-4
  • Type

    conf

  • DOI
    10.1109/EEIC.1999.826176
  • Filename
    826176