• DocumentCode
    1676361
  • Title

    Powdered iron cores for RF magnetics

  • Author

    Smith, Tazzell

  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    107
  • Lastpage
    115
  • Abstract
    Investigations were made to determine what are the effects of varying specific materials and conditions during manufacturing of powdered iron magnetic cores on the initial permeability and Q of the core. Discussions are limited to core material mixes used for RF frequency applications. The following are discussed: (a) the effect of different binder resins on Q and Tc; (b) the effect of differing proportions of insulating acid and resin on inductance and Q; (c) comparison of inductance and Q produced by different material mixes; (d) the effect of pressure applied during molding (material density) on inductance and Q; and (e) an example of improving Q for production cores. This study was proposed to provide information that could be used to improve production yields when winding on powdered iron cores. Improvement of these yields was to be made by improving the performance of the core itself. Specifically, by determining means by which higher Q could be obtained from the core material and how tighter control of initial permeability of the core (and hence inductance) could be achieved
  • Keywords
    Q-factor; inductance; insulation; magnetic permeability; powder cores; Q improvement; RF magnetics; binder resins; core material mixes; inductance; insulating acid; magnetic cores; manufacturing; material density; molding; permeability; powdered iron cores; pressure effect; production cores; resin; Inductance; Insulation; Iron; Magnetic cores; Magnetic materials; Manufacturing; Permeability; Production; Radio frequency; Resins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
  • Conference_Location
    Cincinnati, OH
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-5757-4
  • Type

    conf

  • DOI
    10.1109/EEIC.1999.826190
  • Filename
    826190