• DocumentCode
    1676390
  • Title

    Feasibility study of smart substrate multichip modules

  • Author

    Gattiker, Anne E. ; Maly, Wojciech

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    34608
  • Firstpage
    41
  • Lastpage
    49
  • Abstract
    This paper analyzes the feasibility of MCMs using active silicon substrates with built-in resting circuitry. It identifies the domain of applicability of such MCMs and points to limitations of the “Known Good Die” approach
  • Keywords
    economics; elemental semiconductors; integrated circuit manufacture; integrated circuit testing; intelligent materials; multichip modules; silicon; substrates; Known Good Die; MCM; Si; active silicon substrates; built-in resting circuitry; cost model; prototype; smart substrate multichip modules; Assembly systems; Circuit faults; Circuit testing; Costs; Multichip modules; Packaging; Pins; Probes; Silicon; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1994. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-2103-0
  • Type

    conf

  • DOI
    10.1109/TEST.1994.527934
  • Filename
    527934
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1676390