DocumentCode :
1676539
Title :
Charge behavior observation on/in plasma processed thin films by LIPP during thermal heating for TSDC analysis
Author :
Oda, Tetsuji ; Yamashita, Kouji
Author_Institution :
Dept. of Electr. Eng., Tokyo Univ., Japan
Volume :
1
fYear :
2004
Lastpage :
579
Abstract :
A novel simultaneous space charge measuring system for a charged thin film was developed. The space charge in-depth profile of a charged film is observed by a typical LIPP (laser-induced pressure pulse) method by using a 100 picoseconds YAG laser in a new measuring cell. That new cell can be heated up to 200°C at a constant temperature increasing rate and subpicoampere current flow through a sample thin film can be recorded by a computer system. LIPP method needs only a few second and TSDC current measurement is stopped during that LIPP measuring time that does not affect the final TSDC spectrum which needs much time of roughly an hour. This new combined method can tell us the relationship between the space charge in-depth position and TSDC peaks. Influence of the surface plasma process, which is very popular as anti-static process of a highly insulating polymer film, to the commercially available polymer film is analyzed by this new method. Decrease of some TSDC peaks by the plasma process is observed and their special position can be identified.
Keywords :
charge measurement; electric current measurement; measurement by laser beam; plasma heating by laser; solid lasers; thin films; TSDC current measurement; YAG laser; charged thin film; laser-induced pressure pulse; plasma processed thin films; space charge measuring system; subpicoampere current flow; thermal heating; Charge measurement; Current measurement; Heating; Optical pulses; Plasma applications; Plasma measurements; Polymer films; Pulse measurements; Space charge; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Conference, 2004. 39th IAS Annual Meeting. Conference Record of the 2004 IEEE
ISSN :
0197-2618
Print_ISBN :
0-7803-8486-5
Type :
conf
DOI :
10.1109/IAS.2004.1348463
Filename :
1348463
Link To Document :
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