Title :
QUESTRA crystalline polymer: a new material option for electrical insulation systems
Author :
Burk, Bill ; Peterson, Curt ; Rotstein, Nes ; Brentin, Bob
Author_Institution :
Dow Chem. Co., USA
fDate :
6/21/1905 12:00:00 AM
Abstract :
A new category of semi-crystalline engineering thermoplastics has been developed for electrical insulation systems. QUESTRA, crystalline polymers, are syndiotactic polystyrene (SPS) produced using metallocene catalyst technology. In addition to good heat and chemical resistance characteristic of semi-crystalline thermo-plastics, they also exhibit good electrical properties, dimensional stability and insensitivity to moisture. Injection molding processing is made easier with the low melt viscosity of SPS, which typically needs no pre-drying. Thin wall parts can be filled with modest injection pressure and runner diameters can be reduced. Electrical insulation systems testing according to IEEE 117 and IEC 61857 has been completed and this new thermoplastic is now recognized under UL 1446. This set of properties makes glass-reinforced SPS resin well suited for coil, transformer and motor applications
Keywords :
moulding; organic insulating materials; polymers; viscosity; IEC 61857; IEEE 117; QUESTRA crystalline polymer; UL 1446; chemical resistance; coil applications; dimensional stability; electrical insulation; glass-reinforced SPS resin; heat resistance; injection molding processing; injection pressure; low melt viscosity; metallocene catalyst technology; moisture insensitivity; motor applications; pre-drying; runner diameters; semi-crystalline engineering thermoplastics; syndiotactic polystyrene; thin wall parts; transformer applications; Chemical technology; Crystalline materials; Crystallization; Dielectrics and electrical insulation; Electric resistance; Polymers; Power transformer insulation; Resistance heating; Thermal resistance; Thermal stability;
Conference_Titel :
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
Conference_Location :
Cincinnati, OH
Print_ISBN :
0-7803-5757-4
DOI :
10.1109/EEIC.1999.826209