• DocumentCode
    1677419
  • Title

    Power Aware and Delay Efficient Hybrid CMOS Full-Adder for Ultra Deep Submicron Technology

  • Author

    Konijeti, Narasimha Rao ; Ravindra, J.V.R. ; Yagateela, P.

  • Author_Institution
    Center for Adv. Res. Comput. Lab. (C-ARCL), Vardhaman Coll. of Eng., Hyderabad, India
  • fYear
    2013
  • Firstpage
    697
  • Lastpage
    700
  • Abstract
    Low-power circuits are becoming more attractive due to growing of portable device markets. The 1-bit full adder cell is the key building block for any ASIC design. Designing of such low power full-adder circuits is always a challenging concern for any design research. In this paper, we present a new full-adder cell which is designed with multiple pass transistor logic styles, in which some of them use no power/ground rail approach that helps to reduce power. The proposed full-adder was compared with existing low power full adder cells. All these full-adder cells are designed using Generic Process Design Kit (GPDK) 45 nm technology and they are designed in Cadence virtuoso environment and simulated with Cadence spectre simulator. Pre-layout test bench Simulation results shown that proposed full-adder has the advantage of 60% power savings, 32% Speed Improvements and 72% energy improvements.
  • Keywords
    CMOS logic circuits; adders; application specific integrated circuits; delay circuits; logic design; low-power electronics; ASIC design; Cadence spectre simulator; Cadence virtuoso environment; GPDK technology; full-adder cell; generic process design kit technology; low power full-adder circuits; multiple pass transistor logic styles; portable device markets; power aware-delay efficient hybrid CMOS full-adder; pre-layout test bench simulation; size 45 nm; ultra deep submicron technology; word length 1 bit; Adders; CMOS integrated circuits; Delays; Layout; Multiplexing; Simulation; Transistors; VLSI circuit design; full-adder; low-power; pass transistor logic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Modelling Symposium (EMS), 2013 European
  • Conference_Location
    Manchester
  • Print_ISBN
    978-1-4799-2577-3
  • Type

    conf

  • DOI
    10.1109/EMS.2013.117
  • Filename
    6779929