Title :
Flexible epoxy for low stress electronic component encapsulation
Author :
Phenis, Michael T.
Author_Institution :
Lord Chem. Products, Thermoset Plastics Inc., USA
fDate :
6/21/1905 12:00:00 AM
Abstract :
The following report compares the physical and mechanical properties of the new Thermoset ES-100 flexible epoxy material with two of the top flexible epoxy materials currently available on the market today. One of these materials is from a domestic US manufacturer and the other is from an overseas manufacturer. This report focuses on the thermal aging characteristics of these epoxy materials along with their chemical resistance and resistance to moisture
Keywords :
ageing; electric breakdown; encapsulation; epoxy insulation; insulation testing; mechanical properties; Thermoset ES-100 flexible epoxy material; chemical resistance; insulation breakdown testing; low-stress electronic component encapsulation; moisture resistance; thermal aging characteristics; Chemicals; Circuits; Electronic components; Encapsulation; Manufacturing; Mechanical factors; Moisture; Temperature; Thermal resistance; Thermal stresses;
Conference_Titel :
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
Conference_Location :
Cincinnati, OH
Print_ISBN :
0-7803-5757-4
DOI :
10.1109/EEIC.1999.826253
