Title :
The application of ANSYS software in analyzing and predicting thermal behavior
Author :
Alavizadeh, Ali Reza ; Zargari, Ahmad ; Grise, William R.
Author_Institution :
Morehead State Univ., KY, USA
fDate :
6/21/1905 12:00:00 AM
Abstract :
The purpose of this project is to show how ANSYS software is used to analyze some electrical problems using the coupled-field method. It should be mentioned that this software can be also used in other fields in science and technology (like mechanics, construction and so on) but here the authors just talk about its usage in the electrical engineering field
Keywords :
electrical engineering computing; software packages; temperature distribution; thermal analysis; wires (electric); ANSYS software; computer simulation; coupled-field method; electrical engineering; science; technology; thermal behavior prediction; thermal behaviour analysis; Application software; Conducting materials; Couplings; Finite element methods; Magnetic analysis; Magnetic materials; Material properties; Performance analysis; Solenoids; Temperature distribution;
Conference_Titel :
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
Conference_Location :
Cincinnati, OH
Print_ISBN :
0-7803-5757-4
DOI :
10.1109/EEIC.1999.826274
