DocumentCode
1679193
Title
Electrical characterization of packages for use with GaAs MMIC amplifiers
Author
Smith, S.R. ; Murphy, M.T.
fYear
1993
Firstpage
131
Abstract
A test methodology is presented which combines the advantages of on-wafer RF probing with a TRL (through-reflect-line) calibration to create a completely de-embeddable, novel ´test fixture´ capable of electrically characterizing nearly any style package or device. This scheme has been used to characterize many of the currently available packages for MMIC (monolithic microwave integrated circuit) amplifier products which cover frequencies up to 12 GHz. In addition, the technique has been employed to characterize injection-molded plastic packages and to evaluate nonprobable MMICs.<>
Keywords
III-V semiconductors; MMIC; gallium arsenide; integrated circuit testing; microwave amplifiers; packaging; GaAs; MMIC amplifiers; deembeddable test fixture; injection-molded plastic packages; on-wafer RF probing; packages; test methodology; through-reflect-line calibration; Calibration; Circuit testing; Fixtures; Gallium arsenide; Integrated circuit packaging; MMICs; Microwave devices; Microwave integrated circuits; Radio frequency; Radiofrequency amplifiers;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location
Atlanta, GA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1209-0
Type
conf
DOI
10.1109/MWSYM.1993.276926
Filename
276926
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