Title :
A Novel Coupling-Based Model for Wideband MIMO Channel
Author :
Zhang, Yan ; Hu, Xinwei ; Jia, Yuanzhi ; Zhou, Shidong ; Chen, Xiang ; Wang, Jing
Author_Institution :
Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Abstract :
In this paper, a novel analytical model structure for wideband multiple-input multiple-output (MIMO) channel is presented. It is based on the power coupling between direction of departure (DoD), direction of arrival (DoA) and delay domain. As its realizations, firstly the singular value decomposition (SVD) based model is introduced and the virtual presentation model is extended to the wideband situation. Then a hybrid model is given on basis of the power coupling between the transmit eigenmodes, receive eigenmodes and frequency steering vectors. The hybrid model can provide the tradeoff between the complexity and accuracy. At last, the novel coupling-based model structure is summarized. With a 3.52 GHz wideband MIMO sounder, measurements are carried out in different indoor scenarios. Monte Carlo simulations are used to generate the channel realizations according to these proposed wideband models. Good agreements are achieved between the discussed models and measured data.
Keywords :
MIMO communication; Monte Carlo methods; broadband networks; channel capacity; direction-of-arrival estimation; eigenvalues and eigenfunctions; singular value decomposition; vectors; wireless channels; Monte Carlo simulation; analytical model structure; channel capacity; coupling-based model; delay domain; direction of arrival; direction of departure; frequency steering vector; hybrid model; power coupling; receive eigenmodes; singular value decomposition; transmit eigenmodes; virtual presentation model; wideband MIMO channel; wideband MIMO sounder; wideband multiple-input multiple-output channel; Analytical models; Delay; Laboratories; MIMO; Matrix decomposition; Narrowband; Performance evaluation; Singular value decomposition; Tensile stress; Wideband;
Conference_Titel :
Global Telecommunications Conference, 2009. GLOBECOM 2009. IEEE
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-4148-8
DOI :
10.1109/GLOCOM.2009.5425341