DocumentCode :
167930
Title :
Methods for planar integrated low pass filter performance improvements in high frequency
Author :
Racasan, A. ; Munteanu, C. ; Topa, V. ; Pacurar, C. ; Hebedean, C. ; Cislariu, M.
Author_Institution :
Dept. of Electrotechnics & Meas., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
fYear :
2014
fDate :
16-18 Oct. 2014
Firstpage :
617
Lastpage :
621
Abstract :
The improvement of the performances of a filter involves two major research directions: the first one refers to the attenuation increase (through the increase of the losses) at high frequency and the second one refers to the suppression of the parasitic effects from the constitutive devices. In this light, this paper presents the authors contributions in terms of improving the filter performances through the attenuation increase at high frequency considering also the parasitic effects minimization. Thus, in order to increase the attenuation at high frequency the use of nickel platting method on the copper conductors is proposed, method which will be tested on a low-pass filter constructed in planar electromagnetic technology.
Keywords :
conductors (electric); copper; electromagnetic devices; electroplating; integrated circuit design; low-pass filters; nickel; planarisation; Cu; Ni; copper conductors; nickel plating method; parasitic effects minimization; planar electromagnetic technology; planar integrated low pass filter; attenuation in high frequency; parasite effects; planar electromagnetic technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Power Engineering (EPE), 2014 International Conference and Exposition on
Conference_Location :
Iasi
Type :
conf
DOI :
10.1109/ICEPE.2014.6969983
Filename :
6969983
Link To Document :
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