DocumentCode :
1679819
Title :
3D characterization of air bridges and via holes in conductor-backed coplanar waveguides for MMIC applications
Author :
Visan, S. ; Picon, O. ; Fouad Hanna, V.
Author_Institution :
France Telecom-CNET, Issy-les-Moulineaux, France
fYear :
1993
Firstpage :
709
Abstract :
A 3-D finite-difference time-domain (FDTD) method is used to characterize an air bridge and two via holes which can be used in a conductor-backed coplanar waveguide (CPW) to suppress the coupled slotlinelike mode. The accuracy of the analysis is demonstrated through a comparison of theoretical results obtained using the FDTD method to experimental results for a via hole ground in a microstrip. It is shown that the via hole discontinuity in a conductor-backed CPW is associated with reflection losses lower than those for an air bridge discontinuity. In both cases the CPW keeps its advantage of easy adaptation to both series and shunt element connections.<>
Keywords :
MMIC; finite difference time-domain analysis; losses; microstrip components; 3D characterization; FDTD; MMIC applications; air bridges; conductor-backed CPW; coplanar waveguides; coupled slotlinelike mode; finite-difference time-domain; hole discontinuity; reflection losses; via holes; Bridge circuits; Conductors; Coplanar waveguides; Finite difference methods; Frequency; MMICs; Microstrip; Power transmission lines; Slotline; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location :
Atlanta, GA, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-1209-0
Type :
conf
DOI :
10.1109/MWSYM.1993.277006
Filename :
277006
Link To Document :
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