Title :
Investigations on the reduction of package densities in coplanar circuits
Author :
Becks, T. ; Wolff, I.
Author_Institution :
Inst. for Mobile & Satellite Commun. Tech., Kamp-Lintfort, Germany
Abstract :
A modified method for calculating generalized scattering parameters for neighboring coplanar lines is presented. A full-wave method is used to analyze important parameters such as insertion loss, isolation, and reflection not only for the coplanar mode but also for conversion to the coupled slot line mode. The proposed method is used to analyze various coplanar structures printed on a GaAs substrate of finite height 410 mu m without lower ground metallization and shielding. Numerical results as a function of frequency and distance for approximately 50 Omega lines are obtained.<>
Keywords :
MMIC; S-matrix theory; losses; microstrip components; packaging; transmission line theory; 410 micron; CPW; GaAs substrate; MMIC; coplanar circuits; coplanar lines; coupled slot line mode; full-wave method; generalized scattering parameters; insertion loss; isolation; package densities; reflection; Apertures; Conductors; Coplanar waveguides; Coupling circuits; Electromagnetic fields; Impedance; Metallization; Microstrip; Packaging; Scattering parameters;
Conference_Titel :
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-1209-0
DOI :
10.1109/MWSYM.1993.277024
